Thermo-mechanical reliability of ultra-thin low-loss system-on-package substrates
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Miniaturization and functionality have always governed advances in electronic system technology. To truly achieve the goal of a multi mega-functional system, advances must be made not just at the IC level, but at the system level too. This concept of tighter integration at the system level is called System-on-Package (SOP). While SOP has a wide range of applications, this work targets the mobile application space. The main driver in the mobile application space is package profile. Reduction in thickness is very critical for enabling next-generation ultra-high density mobile products. In order to pack more functionality into a smaller volume, it is absolutely imperative that package profiles are reduced. The NEMI roadmap projects that the package profile should be reduced to 200µm from the current 500µm by 2014. This work attempts to demonstrate the feasibility of ultra-thin substrates (<200µm) using a new advanced material system tailored for high-frequency mobile applications. The main barriers to adoption of thin substrates include processing challenges, concerns about via and through hole reliability and warpage. Each of these factors is studied and a full-fledged test vehicle built to demonstrate the reliability of thin substrates using the advanced low-loss RXP-4/RXP-1 material system. Finite element models are developed to provide an understanding of the factors that affect the reliability of these substrates. Finally, IC assembly is demonstrated on these substrates.