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dc.contributor.authorKrishnan, Ganeshen_US
dc.date.accessioned2009-01-22T15:38:27Z
dc.date.available2009-01-22T15:38:27Z
dc.date.issued2008-11-19en_US
dc.identifier.urihttp://hdl.handle.net/1853/26474
dc.description.abstractMiniaturization and functionality have always governed advances in electronic system technology. To truly achieve the goal of a multi mega-functional system, advances must be made not just at the IC level, but at the system level too. This concept of tighter integration at the system level is called System-on-Package (SOP). While SOP has a wide range of applications, this work targets the mobile application space. The main driver in the mobile application space is package profile. Reduction in thickness is very critical for enabling next-generation ultra-high density mobile products. In order to pack more functionality into a smaller volume, it is absolutely imperative that package profiles are reduced. The NEMI roadmap projects that the package profile should be reduced to 200µm from the current 500µm by 2014. This work attempts to demonstrate the feasibility of ultra-thin substrates (<200µm) using a new advanced material system tailored for high-frequency mobile applications. The main barriers to adoption of thin substrates include processing challenges, concerns about via and through hole reliability and warpage. Each of these factors is studied and a full-fledged test vehicle built to demonstrate the reliability of thin substrates using the advanced low-loss RXP-4/RXP-1 material system. Finite element models are developed to provide an understanding of the factors that affect the reliability of these substrates. Finally, IC assembly is demonstrated on these substrates.en_US
dc.publisherGeorgia Institute of Technologyen_US
dc.subjectMobile applicationsen_US
dc.subjectSubstrateen_US
dc.subjectMicroviaen_US
dc.subjectWarpageen_US
dc.subjectThin substrateen_US
dc.subjectReliabilityen_US
dc.subject.lcshMicroelectronic packaging
dc.subject.lcshMobile computing
dc.subject.lcshMiniature electronic equipment
dc.titleThermo-mechanical reliability of ultra-thin low-loss system-on-package substratesen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMaterials Science and Engineeringen_US
dc.description.advisorCommittee Chair: Tummala, Rao; Committee Member: Pucha, Raghuram V.; Committee Member: Wong, C.Pen_US


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