Development of automated method of optimizing strength of signal received by laser interferometer
Randolph, Tyler W.
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The long-term goal of this research is to assist in the development of a fast, accurate, and low-cost nondestructive inspection prototype for solder joints in integrated circuits (IC). The goal of the work described in this thesis is to develop a fully automated system to maintain the signal strength of the vibrometer that would reduce the testing time while maintaining or improving the quality of the defect detection results. The ability to perform the inspections in an automated manner is very important in order to demonstrate the ability of the defect detection system to be used for online inspection without the need of an operator. The system was able to find the maximum signal strength (at a single point on the surface of a flip chip) nearly five times faster than Polytec's commercial system with a search time of approximately 2.1 sec. When integrated into the nondestructive inspection prototype, the system described in this work was found to approximately reduce the data acquisition time per test location by four times, with a minimum data acquisition time of 8.5 sec and an average time of 15.4 sec, while maintaining the same level of quality of results obtained by a skilled operator when manually maintaining the signal strength of the vibrometer. Hardware was developed that retrofitted a vibrometer's focusing head at the end of a fiber optic cable to a motorized linear stage. This stage controlled the standoff distance between the focusing head and the IC's surface with a fixed focal length, which allowed the spot size of the laser to be adjusted while searching for a desired signal strength. Numerous tests were conducted to determine the search parameters, which led to a search time of approximately 2.1 sec. This time was found to be dependent on the surface finish of the IC being inspected. It was also found that to achieve a desired signal intensity strength, not only does the standoff height of the focusing head, which determines the laser spot size, need to be controlled, but also the exact location on which the laser is reflecting off the IC.