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dc.contributor.authorRudman, Isaak K.en_US
dc.contributor.authorOrloff, David I.en_US
dc.date.accessioned2009-09-04T20:07:01Z
dc.date.available2009-09-04T20:07:01Z
dc.date.issued2001-04
dc.identifier.urihttp://hdl.handle.net/1853/29811
dc.description"April 2001."en_US
dc.descriptionSubmitted to 2001 TAPPI Engineering Conference, San Antonio, TX, September 16-20, 2001.en_US
dc.language.isoen_USen_US
dc.publisherAtlanta, Georgia : the Institute,en_US
dc.publisherGeorgia Institute of Technology
dc.relation.ispartofseriesIPST technical paper series ; number 893en_US
dc.subject.otherThicknessen_US
dc.subject.otherTemperatureen_US
dc.subject.otherWet pressingen_US
dc.subject.otherMeasurementen_US
dc.subject.otherShock dryingen_US
dc.subject.otherCompressionen_US
dc.titleDynamic thickness and temperature measurements during wet pressing and impulse dryingen_US
dc.typeTechnical Paperen_US
dc.contributor.corporatenameInstitute of Paper Science and Technologyen_US


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