Numerical homogenization of a rough bi-material interface
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The mechanical reliability of electronic components has become harder and harder to predict due to the use of composite materials. One of the key issues is creating an accurate model of the delamination mechanism, which consists in the separation of two different bounded materials. This phenomenon is a very challenging issue that is investigated in the Nano Interface Project (NIP), in which this thesis is involved. The macroscopic adhesion force is governed by several parameters described at different length scales. Among these parameters, the roughness profile of the interface has a pronounced influence. The main difficulty for an accurate delamination characterization is then investigating the effects of this roughness profile and the modifications it implies for the overall cohesion. The objective of the NIP is to develop an interface model for the numerical testing of electronic components in a finite element software. The problem is that a direct modeling of all the mechanisms described previously is really expensive in term of computation time, if possible at all. This difficulty is increased by the huge mismatch of the mechanical properties of the materials in contact. A scale transition method is therefore required, which is provided by homogenization. The idea is to consider the delamination at a wider scale. Rather than modeling the whole roughness profile, the adhesion at the interface will be described by homogenized, or macroscopic, parameters extracted from a representative model at the micro-scale, the RVE. This thesis will deal with the determination of these homogenized parameters.