Now showing items 1-2 of 2
Chip-to-Module Interconnections Using "Sea of Leads" Technology
(Georgia Institute of Technology, 2003-01)
The drive toward higher density and higher performance in integrated circuits creates a need to keep interconnects short and eliminate layers of packaging. In this article, we propose a novel, ultrahigh-density (exceeding ...
Polylithic integration of electrical and optical interconnect technologies for gigascale fiber-to-the-chip communication
(Georgia Institute of Technology, 2005-08)
Polylithic integration of electrical and optical interconnect technologies is presented as a solution for merging silicon CMOS and compound semiconductor optoelectronics. In contrast to monolithic and hybrid integration ...