Chip-to-Module Interconnections Using "Sea of Leads" Technology

View/ Open
Date
2003-01Author
Bakir, Muhannad S.
Reed, Hollie A.
Mulé, Anthony V.
Jayachandran, Joseph Paul
Kohl, Paul A.
Martin, Kevin P.
Gaylord, Thomas K.
Meindl, James D.
Metadata
Show full item recordAbstract
The drive toward higher density and higher performance in integrated circuits creates a need to keep interconnects short and eliminate layers of packaging. In this article, we propose a novel, ultrahigh-density (exceeding 10⁴leads per cm²), compliant, wafer-level, input/output interconnection technology called "sea of leads" as a key enabling technology for future high-performance microsystems. The mechanical compliance is addressed through slippery leads (leads released from the surface) and embedded air gaps.The ability to fabricate embedded air gaps has enabled the integration of optical interconnects with high index-of-refraction mismatches between the core and cladding.
Collections
- COPE Publications [376]