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dc.contributor.authorGlytsis, Elias N.en_US
dc.contributor.authorJokerst, Nan M.en_US
dc.contributor.authorVillalaz, Ricardo A.en_US
dc.contributor.authorCho, Sang-Yeonen_US
dc.contributor.authorWu, Shun-Deren_US
dc.contributor.authorHuang, Zhaoranen_US
dc.contributor.authorBrooke, Martin A.en_US
dc.contributor.authorGaylord, Thomas K.en_US
dc.date.accessioned2012-11-06T21:02:55Z
dc.date.available2012-11-06T21:02:55Z
dc.date.issued2003-10
dc.identifier.citationGlytsis, EN and Jokerst, NM and Villalaz, RA and Cho, SY and Wu, SD and Huang, ZR and Brooke, MA and Gaylord, Thomas K., "Substrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: Analysis, design, and performance," Journal of Lightwave Technology, 21, 10, 2382-2394 (October 2003)en_US
dc.identifier.issn0733-8724
dc.identifier.urihttp://hdl.handle.net/1853/45264
dc.description© 2003 IEEE.en_US
dc.descriptionThis is a a joint IEEE/OSA publication. The definitive version of this paper is available at: http://dx.doi.org/10.1109/JLT.2003.818178en_US
dc.descriptionDOI: 10.1109/JLT.2003.818178en_US
dc.description.abstractThe performance of three optoelectronic structures incorporating substrate-embedded InP-based inverted metal–semiconductor–metal photodetectors and/or volume holographic gratings are analyzed and compared at the primary optical communication wavelengths. These structures, in conjunction with optical-quality polymer layers, can be easily integrated into silicon microelectronic substrates for the purpose of implementing potentially low-cost high-data-rate chip-level or substrate-level optical interconnects. The structures are as follows: a) an evanescent-coupling architecture with a substrate- embedded photodetector, b) a volume-holographic-grating coupler architecture with a substrate-embedded photodetector, and c) a volume-holographic-grating coupler architecture with a flip-chip-bonded photodetector. It is found that the primary characteristic of the evanescent coupling architectures is the efficient performance for both TE and TM polarizations with the disadvantage of exponentially decreasing efficiency with increasing separation between the waveguide film layer and the photodetector layer. On the other hand, the primary characteristic of the volume holographic grating architectures is the possibility of wavelength and polarization selectivity and their independence on the separation between the photodetector layer and the waveguide. Comparison of the analysis with experimental results is also included in the case of the evanescent coupling into a substrate-embedded photodetector.en_US
dc.language.isoen_USen_US
dc.publisherGeorgia Institute of Technologyen_US
dc.subjectElectromagnetic couplingen_US
dc.subjectElectromagnetic radiationen_US
dc.subjectGratingsen_US
dc.subjectOptical couplersen_US
dc.subjectOptical interconnectionsen_US
dc.subjectPackagingen_US
dc.subjectPhotodetectorsen_US
dc.titleSubstrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: Analysis, design, and performanceen_US
dc.typeArticleen_US
dc.contributor.corporatenameGeorgia Institute of Technology. Center for Organic Photonics and Electronicsen_US
dc.contributor.corporatenameGeorgia Institute of Technology. School of Electrical and Computer Engineeringen_US
dc.contributor.corporatenameGeorgia Institute of Technology. Microelectronics Research Centeren_US
dc.publisher.originalInstitute of Electrical and Electronics Engineers ; Optical Society of Americaen_US
dc.identifier.doi10.1109/JLT.2003.818178


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