45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnects
MetadataShow full item record
We introduce here a simple method of integrating 45° total internal reflection micro-mirrors with polymer optical waveguides by an improved tilted beam photolithography on printed circuit boards to provide surface normal light coupling between waveguides and optoelectronic devices for optical interconnects. De-ionized water is used to couple ultraviolet beam through the waveguide core polymer layer at 45° angle during the photo exposure process. This technique is compatible with PCB manufacturing facility and suitable to large panel board-level manufacturing. The mirror slope is controlled accurately (within ±1°) with high repeatability. The insertion loss of an uncoated micro-mirror is measured to be 1.6 dB.
- COPE Publications