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dc.contributor.authorWang, Fengtaoen_US
dc.contributor.authorLiu, Fuhanen_US
dc.contributor.authorAdibi, Alien_US
dc.date.accessioned2012-11-08T21:22:48Z
dc.date.available2012-11-08T21:22:48Z
dc.date.issued2009-06
dc.identifier.citationWang, Fengtao and Liu, Fuhan and Adibi, Ali, "45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnects," Optics Express, 17, 13, 10514-10521 (June 22 2009)en_US
dc.identifier.issn1094-4087
dc.identifier.urihttp://hdl.handle.net/1853/45274
dc.description© 2009 Optical Society of Americaen_US
dc.descriptionThe definitive version of this paper is available at: http://dx.doi.org/10.1364/OE.17.010514en_US
dc.descriptionDOI: 10.1364/OE.17.010514en_US
dc.description.abstractWe introduce here a simple method of integrating 45° total internal reflection micro-mirrors with polymer optical waveguides by an improved tilted beam photolithography on printed circuit boards to provide surface normal light coupling between waveguides and optoelectronic devices for optical interconnects. De-ionized water is used to couple ultraviolet beam through the waveguide core polymer layer at 45° angle during the photo exposure process. This technique is compatible with PCB manufacturing facility and suitable to large panel board-level manufacturing. The mirror slope is controlled accurately (within ±1°) with high repeatability. The insertion loss of an uncoated micro-mirror is measured to be 1.6 dB.en_US
dc.language.isoen_USen_US
dc.publisherGeorgia Institute of Technologyen_US
dc.subjectIntegrated optics devicesen_US
dc.subjectOptical fabricationen_US
dc.subjectPolymer waveguidesen_US
dc.title45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnectsen_US
dc.typeArticleen_US
dc.contributor.corporatenameGeorgia Institute of Technology. Center for Organic Photonics and Electronicsen_US
dc.contributor.corporatenameGeorgia Institute of Technology. School of Electrical and Computer Engineeringen_US
dc.publisher.originalOptical Society of Americaen_US
dc.identifier.doi10.1364/OE.17.010514


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