Rapid curing of positive tone photosensitive polybenzoxazole based dielectric resin by variable frequency microwave processing

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Date
2006-06Author
Tanikella, Ravindra V.
Sung, Taehyun
Bidstrup-Allen, Sue Ann
Kohl, Paul A.
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Show full item recordAbstract
High performance polymer dielectrics such as polyimides
and polybenzoxazoles are used for several applications in
the semiconductor industry due to their excellent dielectric and
thermomechanical properties. However, these materials require
curing at high temperatures for long periods of time in order to
achieve the desired properties. High temperature exposure for
long periods of time can be detrimental to device characteristics
and reliability. In this study, rapid low temperature curing of
a positive tone photosensitive polybenzoxazole based dielectric
resin by variable frequency microwave (VFM) processing was
investigated. The chemical changes occurring in the film during
the condensation reaction and the percent conversion achieved as
a function of cure condition were monitored by Fourier transform
infrared spectroscopy. The effectiveness of rapid VFM curing was studied by characterizing
the optical, electrical, and thermomechanical properties of
VFM cured films with thermally cured films. The thermal stability
of cured films was investigated by thermal gravitational analysis
(TGA) and mass spectrometry (MS) studies. The results showed
that a higher percent conversion and higher thermal stability can
be achieved by using VFM processing than can be obtained using
conventional thermal curing at the same cure temperature. However,
the complete removal of photopackage related residual products
requires slow ramp rates and long cure times.
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- COPE Publications [376]