• Login
    View Item 
    •   SMARTech Home
    • Georgia Tech Theses and Dissertations
    • Georgia Tech Theses and Dissertations
    • View Item
    •   SMARTech Home
    • Georgia Tech Theses and Dissertations
    • Georgia Tech Theses and Dissertations
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Moisture and Interfacial Adhesion in Microelectronic Assemblies

    Thumbnail
    View/Open
    ferguson_timothy_p_200407_phd.pdf (3.383Mb)
    Date
    2004-06-21
    Author
    Ferguson, Timothy Patrick
    Metadata
    Show full item record
    Abstract
    In this research, a systematic and multi-disciplinary study was conducted to understand the fundamental science of moisture-induced degradation of interfacial adhesion. The research is comprised of both experimental and modeling components of analysis and consists of four primary components. First, the moisture transport behavior within underfill adhesives is experimentally characterized and incorporated into a finite element model to depict the moisture ingress and interfacial moisture concentration for each respective level of moisture preconditioning. Second, the effect of moisture on the variation of the underfill elastic modulus is demonstrated and the physical mechanisms for the change identified. Third, the aggregate effect of moisture on the interfacial fracture toughness of underfill to both copper and FR-4 board substrates is determined. This includes the primary effect of moisture being physically present at the interface and the secondary effect of moisture changing the elastic modulus of the adhesive when absorbed. Last, the recovery of both the elastic modulus and interfacial fracture toughness from moisture preconditioning is assessed with reversible and irreversible components identified. Using adsorption theory in conjunction with fracture mechanics, an analytical model is developed that predicts the loss in interfacial fracture toughness as a function of moisture content. The model incorporates key parameters relevant to the problem of moisture in epoxy joints identified from the experimental portion of this research, including the interfacial hydrophobicity, epoxy nanopore density, saturation concentration, and density of water. This research results in a comprehensive understanding of the primary mechanisms responsible for the interfacial degradation due to the presence of moisture. The experimental results obtained through this research provide definitive data for the electronics industry to use in their product design, failure analysis, and reliability modeling. The predictive model developed in this research provides a useful tool for developing new adhesives, innovative surface treatment methods, and effective protection methodologies for enhancing interfacial adhesion.
    URI
    http://hdl.handle.net/1853/5003
    Collections
    • Georgia Tech Theses and Dissertations [23403]
    • School of Mechanical Engineering Theses and Dissertations [4008]

    Browse

    All of SMARTechCommunities & CollectionsDatesAuthorsTitlesSubjectsTypesThis CollectionDatesAuthorsTitlesSubjectsTypes

    My SMARTech

    Login

    Statistics

    View Usage StatisticsView Google Analytics Statistics
    facebook instagram twitter youtube
    • My Account
    • Contact us
    • Directory
    • Campus Map
    • Support/Give
    • Library Accessibility
      • About SMARTech
      • SMARTech Terms of Use
    Georgia Tech Library266 4th Street NW, Atlanta, GA 30332
    404.894.4500
    • Emergency Information
    • Legal and Privacy Information
    • Human Trafficking Notice
    • Accessibility
    • Accountability
    • Accreditation
    • Employment
    © 2020 Georgia Institute of Technology