Modeling and process planning for exposure controlled projection lithography
Jariwala, Amit Shashikant
MetadataShow full item record
A novel approach to microfabrication based on stereolithography was presented. This fabrication process is referred to as, ‘Exposure Controlled Projection Lithography’ (ECPL). In the ECPL process, incident radiation, patterned by a dynamic mask, passes through a transparent substrate to cure photopolymer resin. By controlling the amount of exposure, the height field of the cured film can be controlled. An ECPL system was designed and assembled. Factors affecting the accuracy of the ECPL process in fabricating micron shaped features were identified and studied. A real-time in-situ photopolymerization monitoring system was designed and assembled within the ECPL system to identify the sources of variations present in the system. Parts are fabricated from the ECPL process because of polymerization (or cross-linking) of monomer resin using light energy. Photopolymerization is a complex process involving coupling between several phenomena. This process was modeled by utilizing an understanding of the known polymerization reaction kinetics with incorporating the effects of oxygen inhibition and diffusion. A material response model and a simulation tool to estimate the shape of a cured part resulting from photopolymerization was created. This model was used to formulate a process-planning method to estimate the manufacturing process inputs required to cure a part of desired shape and dimensions. The process planning method was validated through simulations and experiments.