Energy efficient active cooling of integrated circuits using embedded thermoelectric devices

Abstract

With technology scaling, the amount of transistors on a single chip doubles itself every 18 months giving rise to increased power density levels. This has directly lead to a rapid increase of thermal induced issues on a chip and effective methodologies of removing the heat from the system has become the order of the day. Thermoelectric (TE) devices have shown promise for on-demand cooling of ICs. However, the additional energy required for cooling remains a challenge for the successful deployment of these devices. This thesis presents a closed loop control system that dynamically switches a TE module between Peltier and Seebeck modes depending on chip temperature. The autonomous system harvests energy during regular operation and uses the harvested energy to cool during high power operation. The system is demonstrated using a commercial thin-film TE device, an integrated boost regulator and few off chip components. The feasibility of the integration of the TEM and the automated mode switching within the microprocessor package is also evaluated. With continuous usage of thermoelectric modules, it starts to degrade over time due to thermal and mechanical induced stress which in turn reduces the cooling performance over time. Impact of thermal cycling on thermoelectric cooling performance over time is evaluated using the developed full chip package model.