Transient simulation for multiscale chip-package structures using the Laguerre-FDTD scheme
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The high-density integrated circuit (IC) gives rise to geometrically complex multiscale chip-package structures whose electromagnetic performance is difficult to predict. This motivates this dissertation to work on an efficient full-wave transient solver that is capable of capturing all the electromagnetic behaviors of such structures with high accuracy and reduced computational complexity compared to the existing methods. In this work, the unconditionally stable Laguerre-FDTD method is adopted as the core algorithm for the transient full-wave solver. As part of this research, skin-effect is rigorously incorporated into the solver which avoids dense meshing inside conductor structures and significantly increases computational efficiency. Moreover, as an alternative to typical planar interconnects for next generation high-speed ICs, substrate integrated waveguide, is investigated. Conductor surface roughness is efficiently modeled to accurately capture its high-frequency loss behavior. To further improve the computational performance of chip-package co-simulation, a novel transient non-conformal domain decomposition method has been proposed. Large-scale chip-package structure can be efficiently simulated by decomposing the computational domain into subdomains with independent meshing strategy. Numerical results demonstrate the capability, accuracy and efficiency of the proposed methods.