Modeling, characterization, and control of the electrical-thermal interactions in advanced packages
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The multi-chip integration in an advanced packaging has made the multi-physics interactions increasingly important. The objective of this research is to address the thermal coupling and the power density limitation of in-package systems through modeling, circuit emulation, and reduce thermal and power couplings. The first research objective is to construct a simulation framework to identify thermal and electrical coupling within the package. The second objective is to evaluate the sub-system's parametric failures across technologies under the influence of the coupling effects. In this analysis, memory systems with the minimal device features were studied under coupling. The framework identifies the interaction of thermal and power coupling for 2D, 2.5D, and 3D integrated coupled victims and predicts the coupling mechanism from the aggressor cores. Third, in order to refine the thermal coupling and supply characterization, a hardware emulation platform is implemented to emulate aggressors' power patterns that resembles in-package high performance cores. Along with the integrated monitoring structures, the hardware platform improves within package observability and evaluates coupling in an advanced package environments. The hardware-assisted emulation framework evaluates the package platform and supplies experimental coupling data to simulation-based systems. Lastly, a thermal-electrical evaluation on a commercial cooling integration is discussed. A full SoC is under investigation on the power, performance, and thermal interaction. The advanced package integration and the system management techniques are applied to observe on system level energy improvement through power and temperature manipulation.