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    Embedded Actives And Discrete Passives In A Cavity Within Build-up Layers

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    8335084.pdf (337.1Kb)
    Date
    12/18/2012
    Author
    Lee, Baik-woo
    Yoon, Chong
    Sundaram, Verkatesh
    Tummala, Rao
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    Abstract
    Disclosed are any electronic system or module which includes embedded actives and discrete passives, and methods for use in fabricating packages containing embedded active devices and/or discrete passive devices. Exemplary apparatus comprises a plurality of build-up layers defining circuit interconnections and that comprise one or more thin film type of embedded passive devices, at least a cavity formed in the build-up layers, and at least an active device and/or at least a discrete passive device disposed in the cavity and electrically connected to the circuit interconnections of the build-up layers. A stiffener may be coupled to an exposed (back) surface of the active device and to an adjacent surface of the build-up layers. The build-up layers may be mounted to a core, and the core may be attached to a printed circuit board. Alternatively, a bottom surface of the build-up layers may be mounted to a printed circuit board without core. The packages have a chip reworkability, an easier thermal management, a very thin profile and enhanced electrical performance comparable to packages produced using chip-first or chip-middle approaches.
    URI
    http://hdl.handle.net/1853/56722
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