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    Compliant Off-chip Interconnects For Use In Electronic Packages And Fabrication Methods

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    8382489.pdf (607.2Kb)
    Date
    2/26/2013
    Author
    Kacker, Karan
    Sitaraman, Suresh K.
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    Abstract
    Disclosed are apparatus comprising single-path and multiple-path compliant interconnects that are coupled between electrical contacts and that allow for increased electrical performance without compromising mechanical reliability. Exemplary apparatus comprises a conductive vertical anchor coupled at a first end to an electrical contact; and one or more conductive arcuate beams coupled at a first end to a second end of the vertical anchor, and coupled at a second end to a second electrical contact. One electrical contact comprises a die contact pad and the other electrical contact comprises a substrate contact pad. Alternatively, one electrical contact comprises a substrate contact pad and the other electrical contact comprises a printed circuit board contact pad. Also, one electrical contact comprises a die contact pad and the other electrical contact comprises a printed circuit board contact pad. Methods of fabricating the apparatus are also disclosed.
    URI
    http://hdl.handle.net/1853/56747
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