Thin-film Capacitor Structures Embedded In Semiconductor Packages And Methods Of Making

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Date
3/5/2013Author
Mcgregor, David Ross
Chan, Cheong-wo Hunter
Dellis, Lynne E.
Liu, Fuhan
Nair, Deepukumar M.
Sundaram, Venkatesh
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Provided are semiconductor packages comprising at least one thin-film capacitor attached to a printed wiring board core through build-up layers, wherein a first electrode of the thin-film capacitor comprises a thin nickel foil, a second electrode of the thin-film capacitor comprises a copper electrode, and a copper layer is formed on the nickel foil. The interconnections between the thin-film capacitor and the semiconductor device provide a low inductance path to transfer charge to and from the semiconductor device. Also provided are methods for fabricating such semiconductor packages.
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- Georgia Tech Patents [1761]