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    Thin-film Capacitor Structures Embedded In Semiconductor Packages And Methods Of Making

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    Date
    3/5/2013
    Author
    Mcgregor, David Ross
    Chan, Cheong-wo Hunter
    Dellis, Lynne E.
    Liu, Fuhan
    Nair, Deepukumar M.
    Sundaram, Venkatesh
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    Abstract
    Provided are semiconductor packages comprising at least one thin-film capacitor attached to a printed wiring board core through build-up layers, wherein a first electrode of the thin-film capacitor comprises a thin nickel foil, a second electrode of the thin-film capacitor comprises a copper electrode, and a copper layer is formed on the nickel foil. The interconnections between the thin-film capacitor and the semiconductor device provide a low inductance path to transfer charge to and from the semiconductor device. Also provided are methods for fabricating such semiconductor packages.
    URI
    http://hdl.handle.net/1853/56748
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