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    Interconnect Assemblies And Methods Of Making And Using Same

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    8633601.pdf (1.012Mb)
    Date
    1/21/2014
    Author
    Kumbhat, Nitesh
    Choudhury, Abhishek
    Sundaram, Venkatesh V.
    Tummala, Rao R.
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    Abstract
    The various embodiments of the present invention provide fine pitch, chip-to-substrate interconnect assemblies, as well as methods of making and using the assemblies. The assemblies generally include a semiconductor having a die pad and a bump disposed thereon and a substrate having a substrate pad disposed thereon. The bump is configured to electrically interconnect at least a portion of the semiconductor with at least a portion of the substrate when the bump is contacted with the substrate pad. In addition, when the bump is contacted to the substrate pad, at least a portion of the bump and at least a portion of the substrate pad are deformed so as to create a non-metallurgical bond therebetween.
    URI
    http://hdl.handle.net/1853/56844
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