Devices Including Composite Thermal Capacitors

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Date
4/29/2014Author
Fedorov, Andrei G.
Green, Craig
Joshi, Yogendra
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Show full item recordAbstract
Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.
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- Georgia Tech Patents [1761]