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dc.date.accessioned2017-05-12T14:26:33Z
dc.date.available2017-05-12T14:26:33Z
dc.date.issued2/10/2015
dc.identifier.urihttp://hdl.handle.net/1853/56957
dc.description.abstractA fully-passive, dynamically configurable directed cooling system for a microelectronic device is disclosed. In general, movable pins are suspended within a cooling plenum between an active layer and a second layer of the microelectronic device. In one embodiment, the second layer is another active layer of the microelectronic device. The movable pins are formed of a material that has a surface tension that decreases as temperature increases such that, in response to a temperature gradient on the surface of the active layer, the movable pins move by capillary flow in the directions of decreasing temperature. By moving in the direction of decreasing temperature, the movable pins move away from hot spots on the surface of the active layer, thereby opening a pathway for preferential flow of a coolant through the cooling plenum at a higher flow rate towards the hot spots.
dc.titlePassive Heat Sink For Dynamic Thermal Management Of Hot Spots
dc.typePatent
dc.contributor.patentcreatorFedorov, Andrei G.
dc.identifier.patentnumber8953314
dc.description.assigneeGeorgia Tech Research Corporation
dc.identifier.patentapplicationnumber13/102314
dc.date.filed5/6/2011
dc.identifier.uspc361/689
dc.identifier.cpcH01L23/44
dc.identifier.cpcH01L23/473
dc.identifier.cpcH01L23/3677


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