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dc.date.accessioned2017-05-12T14:27:02Z
dc.date.available2017-05-12T14:27:02Z
dc.date.issued1/18/1994
dc.identifier.urihttp://hdl.handle.net/1853/57151
dc.description.abstractThree dimensional communication within an integrated circuit occurs via electromagnetic communication between emitters and detectors situated throughout the integrated circuit. The emitters and detectors can be produced in a diode or laser configuration. The emitters and detectors can be fabricated via novel lift-off and alignable deposition processes. Integrated circuit layers, including silicon and gallium arsenide, are transparent to the electromagnetic signals propagated from the emitter and received by the detector. Furthermore, arrays of optical detectors can be implemented to perform image processing with tremendous speed. Processing circuitry can be situated directly below the optical detectors to process in massive parallel signals from individual optical detectors.
dc.titleThree Dimensional Integrated Circuits With Lift-off
dc.typePatent
dc.contributor.patentcreatorJokerst, Nan M.
dc.contributor.patentcreatorBrooke, Martin A.
dc.contributor.patentcreatorAllen, Mark G.
dc.identifier.patentnumber5280184
dc.description.assigneeGeorgia Tech Research Corporation
dc.identifier.patentapplicationnumber07/865379
dc.date.filed4/8/1992
dc.identifier.uspc257/82
dc.identifier.cpcH01L21/2007
dc.identifier.cpcH01L27/14694
dc.identifier.cpcH01S5/183


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