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dc.date.accessioned2017-05-12T14:27:09Z
dc.date.available2017-05-12T14:27:09Z
dc.date.issued3/28/1995
dc.identifier.urihttp://hdl.handle.net/1853/57178
dc.description.abstractVarious novel lift-off and bonding processes (60, 80, 100) permit lift-off of thin film materials and devices (68), comprising Inx Ga1-x Asy P1-y where 0
dc.titleProcesses For Lift-off Of Thin Film Materials Or Devices For Fabricating Three Dimensional Integrated Circuits, Optical Detectors, And Micromechanical Devices
dc.typePatent
dc.contributor.patentcreatorJokerst, Nan M.
dc.contributor.patentcreatorBrooke, Martin A.
dc.contributor.patentcreatorAllen, Mark G.
dc.identifier.patentnumber5401983
dc.description.assigneeGeorgia Tech Research Corporation
dc.identifier.patentapplicationnumber08/044251
dc.date.filed4/7/1993
dc.identifier.uspc257/82
dc.identifier.cpcH01L21/2007
dc.identifier.cpcH01L21/78
dc.identifier.cpcH01L27/14643


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