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    No-flow Underfill Of Epoxy Resin, Anhydride, Fluxing Agent And Surfactant

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    6180696.pdf (530.5Kb)
    Date
    1/30/2001
    Author
    Wong, Ching-ping
    Shi, Song-hua
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    Abstract
    An epoxy material suitable for no-flow underfilling processes with high glass transition temperature can be obtained by curing a solvent free formulation containing an epoxy resin, an organic carboxylic acid anhydride hardener, a curing accelerator, a fluxing agent, a viscosity controlling agent, a coupling agent, and a surfactant.
    URI
    http://hdl.handle.net/1853/57373
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    • Georgia Tech Patents [1761]

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