No-flow Reworkable Epoxy Underfills For Flip-chip Applications

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Date
5/27/2003Author
Wang, Lejun
Li, Haiying
Wong, Ching-ping
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Show full item recordAbstract
A no-flow reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; a curing accelerator; and a fluxing agent wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.
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- Georgia Tech Patents [1761]