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dc.date.accessioned2017-05-12T14:27:54Z
dc.date.available2017-05-12T14:27:54Z
dc.date.issued9/23/2003
dc.identifier.urihttp://hdl.handle.net/1853/57500
dc.description.abstractA flip chip assembly is disclosed that includes a coplanar waveguide launch with a transmission line, and a bump interconnection that includes multiple ground bumps. The transmission line may be a radial transmission line. Similarly, the ground bumps may be arranged in a pseudo-coaxial configuration so as to effect a vertical transition in the flip chip assembly. A method is also disclosed that includes the steps of: providing a coplanar waveguide transmission line launch; providing a chip for attachment to the coplanar waveguide launch; arranging one or more ground bumps on the coplanar waveguide launch; and forming a bump interconnection between the coplanar waveguide launch and the chip. The coplanar waveguide launch provided in this method may include a radial transmission line. The step of arranging the multiple ground bumps may include the step of arranging multiple ground bumps in a pseudo-coaxial configuration.
dc.titleFlip Chip Design On A Coplanar Waveguide With A Pseudo-coaxial Ground Bump Configuration
dc.typePatent
dc.contributor.patentcreatorStaiculescu, Daniela
dc.contributor.patentcreatorLaskar, Joy
dc.identifier.patentnumber6624521
dc.description.assigneeGeorgia Tech Research Corp.
dc.identifier.patentapplicationnumber09/910284
dc.date.filed7/20/2001
dc.identifier.uspc257/778
dc.identifier.cpcH01L23/66
dc.identifier.cpcH01L24/81
dc.identifier.cpcH01L2223/6622


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