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    Guided-wave Optical Interconnections Embedded Within A Microelectronic Wafer-level Batch Package

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    6785458.pdf (2.031Mb)
    Date
    8/31/2004
    Author
    Mule?, (atlanta, Ga)
    Patel, Chirag
    Meindl, James D.
    Gaylord, Thomas K.
    Glytsis, Elias N.
    Martin, Kevin P.
    Schultz, Stephen M.
    Bakir, Muhannad
    Reed, Hollie
    Kohl, Paul
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    Abstract
    Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.
    URI
    http://hdl.handle.net/1853/57540
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