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dc.description.abstractWafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.
dc.titleGuided-wave Optical Interconnections Embedded Within A Microelectronic Wafer-level Batch Package
dc.contributor.patentcreatorMule?, (atlanta, Ga)
dc.contributor.patentcreatorPatel, Chirag
dc.contributor.patentcreatorMeindl, James D.
dc.contributor.patentcreatorGaylord, Thomas K.
dc.contributor.patentcreatorGlytsis, Elias N.
dc.contributor.patentcreatorMartin, Kevin P.
dc.contributor.patentcreatorSchultz, Stephen M.
dc.contributor.patentcreatorBakir, Muhannad
dc.contributor.patentcreatorReed, Hollie
dc.contributor.patentcreatorKohl, Paul
dc.description.assigneeGeorgia Tech Research Corporation

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