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    Backplane, Printed Wiring Board, And/or Multi-chip Module-level Optical Interconnect Layer Having Embedded Air-gap Technologies And Methods Of Fabrication

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    6788867.pdf (834.7Kb)
    Date
    9/7/2004
    Author
    Mule', Tony
    Meindl, James D.
    Kohl, Paul
    Schultz, Stephen M.
    Gaylord, Thomas K.
    Glytsis, Elias N.
    Villalaz, Ricardo
    Bakir, Muhannad
    Reed, Hollie
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    Abstract
    Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.
    URI
    http://hdl.handle.net/1853/57542
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