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    Devices Having Compliant Wafer-level Packages With Pillars And Methods Of Fabrication

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    7132736.pdf (664.5Kb)
    Date
    11/7/2006
    Author
    Bakir, Muhannad S.
    Meindl, James D.
    Patel, Chirag S.
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    Abstract
    Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a substrate having a plurality of die pads disposed thereon and a plurality of leads attached to the plurality of die pads. In addition, the lead package includes a plurality of pillars made of a low modulus material. Each pillar is disposed between the substrate and at least one lead, and each lead is disposed upon one of the pillars that compliantly support the lead.
    URI
    http://hdl.handle.net/1853/57656
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