Lead-free Bonding Systems

View/ Open
Date
7/7/2009Author
Aggarwal, Ankur
Abothu, Isaac R.
Raj, Pulugurtha Markondeya
Tummala, Rao R.
Metadata
Show full item recordAbstract
Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects.
Collections
- Georgia Tech Patents [1761]