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    Lead-free Bonding Systems

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    7556189.pdf (646.4Kb)
    Date
    7/7/2009
    Author
    Aggarwal, Ankur
    Abothu, Isaac R.
    Raj, Pulugurtha Markondeya
    Tummala, Rao R.
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    Abstract
    Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects.
    URI
    http://hdl.handle.net/1853/57806
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    • Georgia Tech Patents [1761]

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