Process Compensated Micromechanical Resonators

Abstract

Disclosed are micromechanical tapered I-shaped bulk acoustic resonators. An exemplary resonator is formed on a substrate, which is preferably silicon. The resonator has a central rod (or extensional member) coupled to two tapered lateral flanges (or flexural members). The central extensional member and tapered flexural members are separated from the substrate. One or more electrodes are disposed adjacent to the tapered flexural members, are separated therefrom by small gaps, and are separated from the substrate. One or more anchors are coupled to the substrate, are laterally separated from the central rod by small gaps, and are coupled to the central rod by supports. The one or more anchors support and suspend the central rod and flexural members from the substrate. Process compensation is achieved using the tapered flexural members.