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dc.date.accessioned2017-05-12T14:28:51Z
dc.date.available2017-05-12T14:28:51Z
dc.date.issued9/21/2010
dc.identifier.urihttp://hdl.handle.net/1853/57882
dc.description.abstractHigh performance interconnect devices, structures, and fabrication methods are provided herein. According to some embodiments of the present invention, an interconnect device used to connect components or route signals in an integrated circuit can comprise multiple conductors. A first conductor of the interconnect device can define a first conductor axis, and a second conductor of the interconnect device can define a second conductor axis. The second conductor can be proximate the first conduct such that first conductor axis is substantially coaxially situated relative to the second conductor axis to provide a high performance interconnect having a coaxial alignment. The first conductor and the second conductor can define a gap disposed between and separating the conductors. Other embodiments are also claimed and described.
dc.titleIntegrated Circuit Interconnects With Coaxial Conductors
dc.typePatent
dc.contributor.patentcreatorKohl, Paul A.
dc.contributor.patentcreatorHe, Ate
dc.contributor.patentcreatorCupta, Mark
dc.contributor.patentcreatorBakir, Muhannad
dc.contributor.patentcreatorSpencer, Todd
dc.identifier.patentnumber7798817
dc.description.assigneeGeorgia Tech Research Corporation
dc.identifier.patentapplicationnumber11/557073
dc.date.filed11/6/2006
dc.identifier.uspc439/66
dc.identifier.cpcH01L21/7682
dc.identifier.cpcH01L23/5225
dc.identifier.cpcH01L23/66


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