Multilayer Finite Difference Methods For Electrical Modeling Of Packages And Printed Circuit Boards

Abstract

Disclosed are exemplary finite difference methods for electromagnetically simulating planar multilayer structures. The exemplary finite difference methods simulate multilayer planes by combining the admittance matrices of single plane pairs and equivalent circuit models for such single plane pairs based on multilayer finite difference approximation. Based on the methods, coupling between different layers through electrically large apertures can be modeled very accurately and efficiently.