Show simple item record

dc.date.accessioned2017-05-12T14:29:14Z
dc.date.available2017-05-12T14:29:14Z
dc.date.issued5/8/2012
dc.identifier.urihttp://hdl.handle.net/1853/58041
dc.description.abstractDisclosed are three-dimensional dielectric structures on high surface area electrodes and fabrication methods. Exemplary structures comprise a copper foil substrate, trench electrodes or high surface area porous electrode structures formed on the substrate, a insulating thin film formed on the surface and laminating the foil on a organic substrate. A variety of materials may be used to make the films including perovksite ceramics such as barium titanate, strontium titanate, barium strontium titanate (BST), lead zirconate titanate (PZT); other intermediate dielectric constant films such as zinc oxide, aluminum nitride, silicon nitride; typical paraelectrics such as tantalum oxide, alumina, and titania. The films may be fabricated using sol-gel, hydrothermal synthesis, anodization or vapor deposition techniques.
dc.titleIntegrating Three-dimensional High Capacitance Density Structures
dc.typePatent
dc.contributor.patentcreatorPulugurtha, Markondeya Raj
dc.contributor.patentcreatorBalaraman, Devarajan
dc.contributor.patentcreatorAbothu, Isaac R.
dc.contributor.patentcreatorTummala, Rao
dc.contributor.patentcreatorAyazi, Farrokh
dc.identifier.patentnumber8174017
dc.description.assigneeGeorgia Tech Research Corporation
dc.identifier.patentapplicationnumber11/505201
dc.date.filed8/16/2006
dc.identifier.uspc257/68
dc.identifier.cpcH01G4/1227
dc.identifier.cpcH01G4/33
dc.identifier.cpcH01L21/84


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record