Method Of Fabricating A Module, For Millimeter Wave Multi-gigabit Wireless Systems
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A method of fabricating an ultra-high frequency module is disclosed. The method includes providing a top layer; drilling the top layer; milling the top layer; providing a bottom; milling the bottom layer to define a bottom layer cavity; aligning the top layer and the bottom layer; and adhering the top layer to the bottom layer. The present invention also includes an ultra-high frequency module operating at ultra-high speeds having a top layer, the top layer defining a top layer cavity; a bottom layer, the bottom layer defining a bottom layer cavity; and an adhesive adhering both the top layer to the bottom layer, wherein the top layer and the bottom layer are formed from a large area panel of a printed circuit board.
- Georgia Tech Patents