Development of 3-D RF microsystems using additive manufactruing technology
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This work intends to explore advanced 3-D integration for state-of-the-art components in wireless systems using various 3-D printing technologies. Several packaging techniques are discussed that utilize the inherent benefits of the 3-D printing techniques. The compatible materials of the 3-D printing system are assessed for their large processing format and compatibility with the build-up process. Single layer and multilayer interconnects, transmission lines are investigated at RF and millimeter-wave (mm-wave) to explore the benefits of each in terms of convenience, reliability, cost, and performance. For the first time，the operation frequency fabricated by 3-D printing is up to D band. A novel vertical via interconnect is applied to the integration of state-of-the-art SoP. Additionally, interconnects that route the signal directly from the chip interface to matching networks are implemented on novel flexible organic material PEN are designed. This work also investigates the possible applications for cavity structures where the benefits of 3-D printing can be exploited for highly integrated receiver systems. Active and passive components are incorporated on LCP using a system-on-package approach to improve performance and enhance capability of the antenna. Wire bond interconnects are utilized as a convenient, low-cost packaging solution, ideal for prototype development.