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    Global Routing Paradigm for System-on-Package

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    git-cercs-03-14.pdf (70.80Kb)
    Date
    2003
    Author
    Minz, Jacob Rajkumar
    Pathak, Mohit
    Lim, Sung Kyu
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    Abstract
    The true potential of three dimensional System-On-Package (SOP) technology lies in its capability to integrate both active and passive components into a single high speed/density multi-layer packaging substrate. We propose a new interconnect-centric SOP global routing algorithm that handles arbitrary routing topologies and produces near optimal results. The contribution of this work is threefold: (i) modeling of the SOP routing resource, (ii) formulation of the new SOP global routing problem, and (iii) development of a fast and novel algorithm that considers the various design constraints unique to SOP. Our related experimental results demonstrate the effectiveness of our algorithm
    URI
    http://hdl.handle.net/1853/5932
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    • CERCS Technical Reports [193]

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