Global Routing Paradigm for System-on-Package

Abstract

The true potential of three dimensional System-On-Package (SOP) technology lies in its capability to integrate both active and passive components into a single high speed/density multi-layer packaging substrate. We propose a new interconnect-centric SOP global routing algorithm that handles arbitrary routing topologies and produces near optimal results. The contribution of this work is threefold: (i) modeling of the SOP routing resource, (ii) formulation of the new SOP global routing problem, and (iii) development of a fast and novel algorithm that considers the various design constraints unique to SOP. Our related experimental results demonstrate the effectiveness of our algorithm