• CAD methodologies for low power and reliable 3D ICs 

      Lee, Young-Joon (Georgia Institute of Technology, 2013-04-02)
      The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based ...
    • Design and prototyping of temperature resilient clock distribution networks 

      Natu, Nitish Umesh (Georgia Institute of Technology, 2014-02-21)
      Clock Distribution Networks play a vital role in performance and reliability of a system. However, temperature gradients observed in 3D ICs hamper the functionality of CDNs in terms of varying skew and propagation delay. ...
    • Hybrid microfluidic cooling and thermal isolation technologies for 3D ICs 

      Zhang, Yue (Georgia Institute of Technology, 2015-04-07)
      A key challenge for three dimensional (3D) integrated circuits (ICs) is thermal management. There are two main thermal challenges in typical 3D ICs. First, in the homogeneous integration with multiple high-power tiers, an ...
    • Low power and reliable design methodologies for 3D ICs 

      Jung, Moongon (Georgia Institute of Technology, 2014-03-03)
      The main objective of this dissertation is to explore and develop computer-aided-design methodologies and optimization techniques for reliability, performance, and power of through-silicon-via-based 3D IC designs. ...
    • Physical design for performance and thermal and power-supply reliability in modern 2D and 3D microarchitectures 

      Healy, Michael Benjamin (Georgia Institute of Technology, 2010-08-27)
      The main objective of this research is to examine the performance, power noise, and thermal trade-offs in modern traditional (2D) and three-dimensionally-integrated (3D) architectures and to present design automation tools ...
    • Physical design methodologies for monolithic 3D ICs 

      Panth, Shreepad Amar (Georgia Institute of Technology, 2015-03-31)
      The objective of this research is to develop physical design methodologies for monolithic 3D ICs and use them to evaluate the improvements in the power-performance envelope offered over 2D ICs. In addition, design-for-test ...
    • TCAD simulation framework for the study of TSV-device interaction 

      Yeleswarapu, Krishnamurthy (Georgia Institute of Technology, 2013-12-17)
      With the reduction in transistor dimensions to a few tens of nanometers as a result of aggressive scaling, interconnect delay has now become one of the major bottlenecks to chip performance. Secondly, interconnect power ...
    • Through-silicon-via-aware prediction and physical design for multi-granularity 3D integrated circuits 

      Kim, Dae Hyun (Georgia Institute of Technology, 2012-03-27)
      The main objective of this research is to predict the wirelength, area, delay, and power of multi-granularity three-dimensional integrated circuits (3D ICs), to develop physical design methodologies and algorithms for the ...