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    Quantification of ultrasonic shear wave scattering from an element of a compound scatterer in a bonded plate via wavefield imaging

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    MAKI-THESIS-2017.pdf (2.582Mb)
    Date
    2017-05-17
    Author
    Maki, Carson
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    Abstract
    This work addresses ultrasonic shear wave scattering from buried defects emanating from through-holes in bonded metallic specimens. Methods are developed for segregating, analyzing, and quantifying scattering from a single element of a compound scatterer via ultrasonic wavefield imaging. Wavefield baseline subtraction is applied for this type of segregation; however, it is shown to fail if a suitable baseline is not available. Research tasks include specimen design and fabrication, measurement technique and data quality improvement, and development of various analysis methods using such techniques as frequency-wavenumber filtering, temporal and spatial windowing, and direct image analysis.
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    http://hdl.handle.net/1853/60124
    Collections
    • Georgia Tech Theses and Dissertations [23877]
    • School of Mechanical Engineering Theses and Dissertations [4086]

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