Quantification of ultrasonic shear wave scattering from an element of a compound scatterer in a bonded plate via wavefield imaging
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This work addresses ultrasonic shear wave scattering from buried defects emanating from through-holes in bonded metallic specimens. Methods are developed for segregating, analyzing, and quantifying scattering from a single element of a compound scatterer via ultrasonic wavefield imaging. Wavefield baseline subtraction is applied for this type of segregation; however, it is shown to fail if a suitable baseline is not available. Research tasks include specimen design and fabrication, measurement technique and data quality improvement, and development of various analysis methods using such techniques as frequency-wavenumber filtering, temporal and spatial windowing, and direct image analysis.
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