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dc.contributor.advisorJacobs, Laurence
dc.contributor.advisorMichaels, Jennifer
dc.contributor.authorMaki, Carson
dc.date.accessioned2018-08-20T15:28:01Z
dc.date.available2018-08-20T15:28:01Z
dc.date.created2017-08
dc.date.issued2017-05-17
dc.date.submittedAugust 2017
dc.identifier.urihttp://hdl.handle.net/1853/60124
dc.description.abstractThis work addresses ultrasonic shear wave scattering from buried defects emanating from through-holes in bonded metallic specimens. Methods are developed for segregating, analyzing, and quantifying scattering from a single element of a compound scatterer via ultrasonic wavefield imaging. Wavefield baseline subtraction is applied for this type of segregation; however, it is shown to fail if a suitable baseline is not available. Research tasks include specimen design and fabrication, measurement technique and data quality improvement, and development of various analysis methods using such techniques as frequency-wavenumber filtering, temporal and spatial windowing, and direct image analysis.
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherGeorgia Institute of Technology
dc.subjectUltrasonic scattering
dc.subjectWavefield imaging
dc.subjectAngle-beam testing
dc.subjectUltrasonic testing
dc.subjectDamage quantification in layered plates
dc.subjectCompound scattering
dc.subjectCompound scatterer
dc.subjectDefect scattering segregation
dc.subjectScattering segregation
dc.subjectBonded plates
dc.subjectAluminum plates
dc.subjectLDV sensing
dc.titleQuantification of ultrasonic shear wave scattering from an element of a compound scatterer in a bonded plate via wavefield imaging
dc.typeThesis
dc.description.degreeM.S.
dc.contributor.departmentMechanical Engineering
thesis.degree.levelMasters
dc.contributor.committeeMemberRuzzene, Massimo
dc.contributor.committeeMemberSabra, Karim
dc.date.updated2018-08-20T15:28:01Z


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