• An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages 

      Wong, C. P.; Li, Haiying; Jacob, Karl I. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2003-02)
      Effective heat dissipation is crucial to enhance the performance and reliability of electronic devices. In this work, the performance of encapsulants filled with carbon fiber was studied and compared with silica filled ...