• Assembly of Lead-free Bumped Flip-Chip with No-Flow Underfills 

      Wong, C. P.; Zhang, Zhuqing (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-04)
      Lead-free solder reflow process has presented challenges to no-flow underfill material and assembly. The currently available no-flow underfill materials are mainly designed for eutectic Sn–Pb solders. This paper presents ...