Browsing School of Materials Science and Engineering (MSE) by Subject "Underfill out-gassing"
Now showing items 1-1 of 1
(Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2002-04)Lead-free solder reflow process has presented challenges to no-flow underfill material and assembly. The currently available no-flow underfill materials are mainly designed for eutectic Sn–Pb solders. This paper presents ...