• Effective Elastic Modulus of Underfill Material for Flip-Chip Applications 

      Wong, C. P.; Qu, Jianmin (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 2000-03)
      In this paper, a micromechanics model based on the Mori–Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler ...
    • Fast-Flow Underfill Encapsulant: Flow Rate and Coefficient of Thermal Expansion 

      Wong, C. P.; Vincent, Michael Brien; Shi, Songhua (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1998-06)
      In the flip-chip on board assembly method, an underfill encapsulant material is applied in the gap between the integrated circuit (IC) chip and substrate to distribute the shear stresses at the solder interconnects. ...
    • Recent Advances in Plastic Packaging of Flip-Chip and Multichip Modules (MCM) of Microelectronics 

      Wong, C. P.; Wong, Michelle M. (Georgia Institute of TechnologyInstitute of Electrical and Electronics Engineers, Inc., New York, 1999-03)
      The success in consumer electronics in the 1990’s will be focused on low-cost and high performance electronics. Recent advances in polymeric materials (plastics) and integrated circuit (IC) encapsulants have made ...