Now showing items 1-10 of 12
Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications
(Georgia Institute of Technology, 2001-03)
No-flow underfill process in flip-chip assembly has become a promising technology toward a smaller, faster and more cost-efficient packaging technology. The current available no-flow underfill materials are mainly ...
FEM Modeling of Temperature Distribution of a Flip-Chip No-Flow Underfill Package During Solder Reflow Process
(Georgia Institute of Technology, 2004-01)
Flip chip on organic substrate has relied on underfill to redistribute the thermomechanical stress and to enhance the solder joint reliability. However, the conventional flip-chip underfill process involves multiple ...
Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications
(Georgia Institute of Technology, 2006-03)
The nanosilica filled composite is a promising material for the no-flow underfill in flip-chip application. However, as the filler size decreases into the nano length scale, the rheological, mechanical, and thermal mechanical ...
Modeling of the Curing Kinetics of No-Flow Underfill in Flip-Chip Applications
(Georgia Institute of Technology, 2004-06)
No-flow underfill has greatly improved the production efficiency of flip-chip process. Due to its unique characteristics, including reaction latency, curing under solder reflow conditions and the desire for no post-cure, ...
Novel Reworkable Fluxing Underfill for Board-Level Assembly
(Georgia Institute of Technology, 2004-09)
Underfills are traditionally applied for flip-chip applications. Recently, there has been increasing use of underfill for board-level assembly including ball grid arrays (BGAs) and chip scale packages (CSPs) to enhance ...
Development of Environmental Friendly Non-Anhydride No-Flow Underfills
(Georgia Institute of Technology, 2002-03)
Most no-flow underfill materials are based on poxy/anhydride chemistry. Due to the sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using nonanhydride curing system. This ...
Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability
(Georgia Institute of Technology, 2004-08)
In order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the thermomechanical stress created by the coefficient of thermal expansion (CTE) mismatch between ...
Assembly of Lead-free Bumped Flip-Chip with No-Flow Underfills
(Georgia Institute of Technology, 2002-04)
Lead-free solder reflow process has presented challenges to no-flow underfill material and assembly. The currently available no-flow underfill materials are mainly designed for eutectic Sn–Pb solders. This paper presents ...
Study on the curing process of no-flow and wafer level underfill for flip-chip applications
(Georgia Institute of Technology, 2003-12-01)
Double-Layer No-Flow Underfill Materials and Process
(Georgia Institute of Technology, 2003-05)
The no-flow underfill has been invented and practiced in the industry for a few years. However, due to the interfering of silica fillers with solder joint formation, most no-flow underfills are not filled with silica ...