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    Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives 

    Wong, C. P.; Lu, Daoqiang; Tong, Quinn K. (Georgia Institute of Technology, 1999-07)
    One critical obstacle of current conductive adhesives is their unstable contact resistance with nonnoble metal finished components during high temperature and humidity aging. It is commonly accepted that metal oxide ...

    Fundamental understanding of electrically conductive adhesives (ECA's) 

    Lu, Daoqiang (Georgia Institute of Technology, 2000-08)
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    Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $pi$ -Conjugated Self-Assembled Molecular Wire Junctions 

    Zhang, Rongwei; Li, Yi; Yim, Myung Jin; Moon, Kyoung-Sik; Lu, Daoqiang; Wong, C. P. (Georgia Institute of Technology, 2009-09)
    We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer- sized ( 500 nm in diameter) silver (Ag) particle as conductive filler with the effect of -conjugated ...
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    Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s) 

    Wong, C. P.; Lu, Daoqiang; Tong, Quinn K. (Georgia Institute of Technology, 1999-07)
    Isotropic conductive adhesives (ICA’s) are usually composites of adhesive resins with conductive fillers (mainly silver flakes). The adhesive pastes before cure usually have low electrical conductivity. The conductive ...
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    A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives 

    Wong, C. P.; Lu, Daoqiang (Georgia Institute of Technology, 1999-09)
    Conductive adhesives are composites of polymer matrixes and metal fillers (conductive elements). Silver (Ag) flakes are widely used as fillers for electrically conductive adhesives (ECA’s). Generally, there is a thin ...
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    Development of Conductive Adhesives for Solder Replacement 

    Wong, C. P.; Lu, Daoqiang (Georgia Institute of Technology, 2000-12)
    With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as an environmentally friendly alternative to tin/lead (Sn/Pb) solders in electronics packaging applications. ...
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    A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems 

    Wong, C. P.; Lu, Daoqiang (Georgia Institute of Technology, 2000-09)
    Electrically conductive adhesives (ECAs) are an environmentally friendly alternative to tin/lead (Sn/Pb) solders in electronics packaging applications. However, current conductive technology is still in its infancy and ...

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    Lu, Daoqiang (7)
    Wong, C. P. (6)Tong, Quinn K. (2)Li, Yi (1)Moon, Kyoung-Sik (1)Yim, Myung Jin (1)Zhang, Rongwei (1)SubjectConductive adhesives (3)Adhesives (2)Contact resistance shift (2)Corrosion inhibitors (2)Electronics packaging (2)Anhydride (1)Conductivity establishment (1)Contact resistance (1)Electric conductivity (1)Electrical conductivity (1)... View MoreDate Issued1999 (3)2000 (3)2009 (1)Has File(s)Yes (7)
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