Modifying the depolymerization of sacrifical polymers for electronic devices
Phillips, Oluwadamilola S.
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Decomposable polymers can be used in fabrication of integrated circuits and packages. Polymers that can be triggered to depolymerize into volatile, monomeric units are particularly useful as template materials for the creation of embedded-air cavities in the fabrication of traditional integrated circuits, MEMS packaging solutions, and transient (disposable) electronics. The understanding and controlling of the mechanism of thermal depolymerization of these polymers is important. The thermal decomposition of polypropylene carbonate has been changed by end-capping the polymer. This has expanded their use by allowing higher temperature thermal processes. The stimulus for the thermal decomposition has been controlled via photochemical reaction that can be targeted to specific wavelengths of light. The temperature range of the liquid-state after depolymerization of polyaldehdyes has been extended to lower temperatures by depressing the freezing point of the monomer. Liquid products are desirable because the monomer can absorb into the surrounding environment. Dual-layer structures have been demonstrated to limit the photo-chemical trigger to one region, where the acid-catalyst for degradation can propagate to unexposed regions. The multi-layer structure allows for fabrication of a wide-range of devices where the photosensitive trigger can be added at the last fabrication step. The results in this dissertation have created a pathway for the development and application of a new family of transient, photodegradable materials that can be tuned from wavelengths in the ultraviolet light region into the near-infrared regions at ambient or subzero temperatures.