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dc.contributor.authorDanyluk, Steven S.
dc.contributor.authorYang, Yeyuan (Chris)
dc.date.accessioned2019-05-02T15:47:47Z
dc.date.available2019-05-02T15:47:47Z
dc.date.issued2012-06
dc.identifier.urihttp://hdl.handle.net/1853/61016
dc.descriptionIssued as final reporten_US
dc.description.abstractThe research objectives of this project were to validate a new concept in surface inspection of thin crystalline silicon wafers of the type used in photovoltaic manufacturing with electrostatic imaging technique (Kelvin probes) to reveal surface cracks.en_US
dc.description.sponsorshipNational Science Foundation (U.S.)en_US
dc.language.isoen_USen_US
dc.publisherGeorgia Institute of Technologyen_US
dc.relation.ispartofseriesManufacturing Research Center ; Project no. 114594en_US
dc.subjectSilicon wafersen_US
dc.subjectMicro-crackingen_US
dc.titleNew concept for low cost, high throughput inspection for cracks in PV manufacturingen_US
dc.typeTechnical Reporten_US
dc.contributor.corporatenameGeorgia Institute of Technology. Office of Sponsored Programsen_US
dc.contributor.corporatenameGeorgia Institute of Technology. Manufacturing Research Centeren_US
dc.contributor.corporatenameGeorgia Institute of Technology. School of Mechanical Engineeringen_US


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