| dc.contributor.author | Danyluk, Steven S. | |
| dc.contributor.author | Yang, Yeyuan (Chris) | |
| dc.date.accessioned | 2019-05-02T15:47:47Z | |
| dc.date.available | 2019-05-02T15:47:47Z | |
| dc.date.issued | 2012-06 | |
| dc.identifier.uri | http://hdl.handle.net/1853/61016 | |
| dc.description | Issued as final report | en_US |
| dc.description.abstract | The research objectives of this project were to validate a new concept in surface inspection of thin crystalline silicon wafers of the type used in photovoltaic manufacturing with electrostatic imaging technique (Kelvin probes) to reveal surface cracks. | en_US |
| dc.description.sponsorship | National Science Foundation (U.S.) | en_US |
| dc.language.iso | en_US | en_US |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.relation.ispartofseries | Manufacturing Research Center ; Project no. 114594 | en_US |
| dc.subject | Silicon wafers | en_US |
| dc.subject | Micro-cracking | en_US |
| dc.title | New concept for low cost, high throughput inspection for cracks in PV manufacturing | en_US |
| dc.type | Technical Report | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. Office of Sponsored Programs | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. Manufacturing Research Center | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Mechanical Engineering | en_US |
