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    Wire-bonding Overview and Packaging Toolsets at Georgia Tech IEN

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    Date
    2020-06-11
    Author
    White, Christopher P.
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    Abstract
    The shared user labs within the Institute for Electronics and Nanotechnology at Georgia Tech include an electronics packaging toolset. A brief overview of assembly and interconnection toolsets and technologies available within IEN will be presented. A process overview on wire-bonding capabilities will also be discussed.
    URI
    http://hdl.handle.net/1853/62939
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    • IEN Seminars [18]

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